发明名称 |
POLISHING COMPOSITION, MANUFACTURING PROCESS THEREFOR, UNDILUTED LIQUID, PROCESS FOR PRODUCING SILICON SUBSTRATE, AND SILICON SUBSTRATE |
摘要 |
<p>A polishing composition is obtained through diluting an undiluted liquid containing abrasive grains. When R1 is defined as an average secondary particle diameter of the abrasive grains in the undiluted liquid and R2 is defined as an average secondary particle diameter of the abrasive grains in the polishing composition, the ratio R2/R1 is 1.2 or less. The polishing composition is used for polishing a silicon substrate material to produce a silicon substrate.</p> |
申请公布号 |
SG11201404040U(A) |
申请公布日期 |
2014.10.30 |
申请号 |
SG11201404040U |
申请日期 |
2013.01.16 |
申请人 |
FUJIMI INCORPORATED |
发明人 |
TSUCHIYA, KOHSUKE;MORI, YOSHIO;TAKAHASHI, SHUHEI;TAKAMI, SHINICHIRO |
分类号 |
H01L21/304;B24B37/00;C09K3/14 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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