| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component mounting module which prevents the deterioration of the quality of signals by reducing the transmission loss of the signals flowing between multiple electronic component mounting units. <P>SOLUTION: An electronic component mounting module 1 includes: a socket 70 installed on a mother board 2; and electronic component mounting units 41, 51 connecting with the socket 70. The electronic component mounting units 41, 51 respectively includes wiring boards 10, 50 and electrodes 47, 62 are respectively disposed on substrate rear surfaces 13, 53. The socket 70 includes a first conductive metal component 91 and a second conductive metal component 101. The first conductive metal component 91 electrically connects the electronic component mounting units 41, 51 with the mother board 2, and the second conductive metal component 101 electrically connects the electronic component mounting units 41, 51 with each other. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
