| 摘要 |
<p>The invention provides a detection device capable of accurately detecting opaque materials that are located at sealed resin portions of chip LEDs. The detection device comprises a support member 5 for supporting a chip LED 50; an upper illuminating mechanism 10 for illuminating the surface of the chip LED 50; a camera for shooting images of the surface of the chip LED 50; and a determining portion 8 for making an analysis of the shot images and determining whether foreign matters exist. The upper illuminating mechanism 10 is composed of a first illuminating portion and a second illuminating portion, wherein the first illuminating portion has a dome-shaped body and a plurality of light sources configured in the dome-shaped body and indirectly illuminates the part therebelow through lights that are emitted downwardly from an opening portion below the dome-shaped body, and the second illuminating portion has an annular body and a plurality of light sources configured below the annular body and directly illuminates the part therebelow through lights that are emitted by the light sources. The camera 6 is configured above the first illuminating portion to shoot images of the surface of the chip LED 50 through a shooting-purpose opening portion.</p> |
