| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for machining the inside of a substrate which prevent the cracks of the substrate upon the formation of an inside modified layer and improve a product yield by preventing coincidence between the cleavage direction of the substrate and the moving direction of the condensing point of a laser beam. <P>SOLUTION: The apparatus 1 for machining the inside of a substrate includes a substrate rotating means 2, an irradiation device 4 and a second condensing means movement device 150, wherein the substrate rotating means 2 includes: a rotary stage 110, a substrate fixing means 130 which is arranged on the rotary stage and places the substrate 10 thereon, and a rotary stage control means 300 controlling the number of revolution of the rotary stage; the irradiation device 4 includes: a laser beam source 220, a laser condensing means 16, and a first condensing means movement device 25 regulating the distance between the laser condensing means and the rotary stage; the second condensing means movement device 150 relatively moves the rotary stage and the laser condensing means between the rotation axis 140 of the rotary stage and the outer circumference of the rotary stage, and wherein the substrate is arranged on the rotary stage at an interval and symmetrically to the rotation axis. The method for machining the inside of a substrate uses the apparatus. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
