| 摘要 |
<p>The present invention relates to a multi-layer high functional magnetic film and, more specifically, to a multi-layer high functional magnetic film arranged in thin multi-layers, and where each multi-layer having a characteristic function is integrally formed by hot pressure welding. The present invention has an effect of simplifying a manufacture process, and making a finished product thin by integrally adding functions such as a magnetic functional layer for magnetic coupling enhancing or an electromagnetic wave shielding, absorbing layer for EMI/EMC, etc., to a flexible printed circuit board used in a smartphone, a tablet PC, a laptop computer, etc. Moreover, the function can be improved by widening the applicable space of a magnetic functional layer as the use of an adhesive tape is excluded. Moreover, the present invention has an effect of simplifying the manufacture process, and improving the characteristic function by making the distance between the magnetic functional layer and an antenna closer. Moreover, the present invention has an effect of replacing the role of a cover layer in the flexible printed circuit board, and improving the workability when a thin film such as polyethylene terephthalate (PET), polyphenylenesulfide (PPS), polyimide (PI), etc., is used as a carrier film.</p> |
