发明名称 ENHANCED THERMAL DIFFUSION SHEETS AND THE USE OF ELECTRONIC DEVICES
摘要 <p>In order to solve the problems of a graphitic sheet using a graphitic heat-diffusion material, the present invention makes it possible to manufacture a heat-diffusion sheet, of which anisotropy of heat conductivity is increased by manufacturing a composite of a ceramic insulation layer and a conductive adhesive layer on a copper thin film layer so as to increase a horizontal heat conductivity with respect to a vertical heat conductivity. In addition, the present invention is intended to solve a rise in a surface temperature of an electronic device by absorbing and dispersing heat generated in the electronic device by using the heat-diffusion material as a heat spreader of the electronic device including a portable communications device. The portable communications devices including the heat-diffusion sheet comprises a polychlorinated binpheneyl (PCB) substrate, a heat source under the PCB substrate, a first heat-diffusion sheet under the heat source, a battery under the first heat diffusion sheet, a second heat diffusion sheet under the battery, and an outer case which surrounds the PCB substrate, the heat source, the first heat-diffusion sheet, the battery, and the second heat-diffusion sheet from the outside.</p>
申请公布号 KR20140125530(A) 申请公布日期 2014.10.29
申请号 KR20130043401 申请日期 2013.04.19
申请人 CHANG SUNG CO.;LG ELECTRONICS INC. 发明人 CHOI, HYUN SEOK;LEE, KYUNG SUB;KANG, MIN SUNG;LEE, DONG HYUN;KIM, JAE HOON;CHOI, JOON SIK
分类号 H05K7/20;B32B15/08 主分类号 H05K7/20
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