| 摘要 |
<p>Provided is an electronic component installing device which can inhibit the increase of substrate conveying time. The electronic component installing device (100) is a device which installs an electronic component on a substrate. The electronic component installing device (100) comprises a plurality of object stages (3FI, 3RI, 3FI, 3RI) which install and support substrates. The substrates are conveyed from a substrate supply part (1) to a substrate output part (2). Two object stages (3FI, 3RI) are disposed along a direction orthogonal to the conveying direction of the substrate and move along the direction.</p> |
