发明名称 レーザ処理装置およびレーザ処理方法
摘要 PROBLEM TO BE SOLVED: To provide a laser processing apparatus capable of correctly measuring the output of an irradiation laser beam without causing deterioration in the productivity.SOLUTION: The laser processing apparatus includes a laser oscillation source (laser oscillator 2) for emitting a laser beam; an optical system 4 for guiding the laser beam to a workpiece 8; and a measurement means (measurement device 10) for measuring the reflected laser beam emitted to and reflected on the workpiece. The laser processing apparatus is used to irradiate the workpiece with the laser beam to process the workpiece; measure the laser beam whose one part is reflected on the workpiece to estimate power or energy of the laser beam emitted to the workpiece; compare the power or energy with a predetermined threshold value; and determine whether the power or energy of the laser beam is proper, on the basis of the result of the comparison.
申请公布号 JP5614768(B2) 申请公布日期 2014.10.29
申请号 JP20100070911 申请日期 2010.03.25
申请人 株式会社日本製鋼所 发明人 鄭 石煥
分类号 H01L21/268;B23K26/00 主分类号 H01L21/268
代理机构 代理人
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