| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin composition which has good resin setting properties, that is to say, does not require a high temperature and long time treatment when a prepreg is laminated, and is good in curability and storage stability of varnish and the prepreg and excellent in chemical resistance, heat resistance, adhesion, and low warpage, and to provide the prepreg, a laminated board and a multilayer printed wiring board, each using the composition. <P>SOLUTION: The thermosetting resin composition contains: (A) a resin composition having an unsaturated maleimide group which is produced by reacting a maleimide compound (a) having at least two N-substituted maleimide groups in one molecule with an amine compound (b) having at least two primary amino groups in one molecule in an organic solvent; a thermosetting resin (B) ; and a specific modified imidazole compound (C). Further, there are also provided the prepreg, the laminated board, and the multilayer printed wiring board obtained by using the composition. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
