| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition and a resin composition for seal-filling semiconductor excellent in toughness, and a semiconductor device manufactured using the same. <P>SOLUTION: The epoxy resin composition includes (a) an epoxy resin, (b) a curing agent, and (c) a second epoxy resin wherein an epoxy group in its molecule does not form a glycidyl ether structure with a phenolic hydroxy group. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
