发明名称 |
SIMPLIFIED PITCH DOUBLING PROCESS FLOW |
摘要 |
<p>A method for fabricating a semiconductor device comprises patterning a layer of photoresist material to form a plurality of mandrels in a device array region. The method further comprises depositing an oxide material over the plurality of mandrels and over a device peripheral region. The method further comprises forming a pattern of photoresist material over the oxide material in the device peripheral region. The method further comprises anisotropically etching the oxide material from exposed horizontal surfaces in the device array region. The method further comprises selectively etching photoresist material from the device array region and from the device peripheral region.</p> |
申请公布号 |
EP2011141(B1) |
申请公布日期 |
2014.10.29 |
申请号 |
EP20070794840 |
申请日期 |
2007.05.14 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
NIROOMAND, ARDAVAN;ZHOU, BAOSUO;ALAPATI, RAMAKANTH |
分类号 |
H01L21/033;H01L21/308 |
主分类号 |
H01L21/033 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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