PROCESS FOR TEXTURING THE SURFACE OF A SILICON SUBSTRATE, STRUCTURED SUBSTRATE AND PHOTOVOLTAIC DEVICE COMPRISING SUCH A STRUCTURED SUBSTRATE

摘要

The invention relates to a process for texturing the surface of a silicon substrate, comprising a step of exposing said surface to an MDECR plasma generated, at least from argon, using between 1.5 W/cm2 and 6.5 W/cm2 of plasma power in a matrix distributed electron cyclotron resonance plasma source, the substrate bias being between 100 V and 300 V.