发明名称 |
PRODUCTION METHOD FOR LEADFRAME-BASED COMPONENT HOUSING |
摘要 |
<p>A leadframe-based housing for a surface-mountable component, particularly a radiation-emitting component. The leadframe-based housing comprises electrical connector strips and at least one chip mounting area. One of the connector strips includes an injection aperture that enables a leadframe-based housing to be produced with a very small thickness in an injection molding process. A method for producing such housings is further specified.</p> |
申请公布号 |
EP1540745(B1) |
申请公布日期 |
2014.10.29 |
申请号 |
EP20030747830 |
申请日期 |
2003.09.05 |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
SORG, JÖRG, ERICH |
分类号 |
H01L33/00;H01L31/02;H01L31/0203;H01L33/48;H01L33/62 |
主分类号 |
H01L33/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|