| 摘要 |
<p>In an existing sand blast processed release sheet, the sealing of mold resin on a lead frame is interrupted and the mold resin is leaked since granules generated in a manufacturing process of a sand blast process and remained on the surface of a base are in contact with the lead frame. Thus, the existing release sheet has a problem that the production yield rate of semiconductor devices becomes worse. Therefore, the present invention is to provide a release sheet capable of molding the semiconductor devices without the leakage of the mold resin by preventing low molecular weight components formed on the base film of the release sheet from being attached to the mold since the sealing of the mold resin with respect to the lead frame is not interrupted. The release sheet is formed by stacking an uneven layer having particles, the base, and a resin layer. It is desirable that the content of the particles is 10-85 mass% with respect to the total mass of the uneven layer and the surface roughness Ra of the uneven layer is 0.2 micrometers <= Ra <= 2.5 micrometers.</p> |
