发明名称 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
摘要 <p>A longitudinal substrate support according to the present invention used in an arrangement type substrate processing apparatus having a processing chamber and a loading chamber, comprises: a substrate boat supporting a plurality of substrates in a longitudinal direction; a cap arranged on one side of the substrate boat and opening and closing an opening part formed between the processing chamber and the loading chamber; and injection holes formed on a side of the cap for injecting gas to the outside of the cap. Additionally, an auto shutter according to the present invention used in the arrangement type substrate processing apparatus having the processing chamber and the loading chamber, comprises: a cover body configured to be able to open and close an opening part formed between the processing chamber and the loading chamber; a driving part driving the cover body to open the opening part in a case of carrying the substrate boat, supporting the substrates in a longitudinal direction, into the processing chamber and to close the opening part in a case of carrying the substrate boat into the loading chamber; and an injection unit formed on a side of the cover body for injecting gas to the outside of the cover body. The substrate processing apparatus according to the present invention includes either the longitudinal substrate support part or the auto shutter.</p>
申请公布号 KR20140125654(A) 申请公布日期 2014.10.29
申请号 KR20130043745 申请日期 2013.04.19
申请人 TOKYO ELECTRON LIMITED 发明人 SON, SUNG DUK
分类号 H01L21/683;H01L21/205;H01L21/22 主分类号 H01L21/683
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