| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which reduces variations in processing in a substrate surface and between substrates and improves product performance and production yield. <P>SOLUTION: A substrate processing apparatus includes a tank TK in which a processing substrate 1 is housed, sending mechanisms TB, A sending out a liquid or a gas or the liquid and the gas to the processing tank TK, and discharge means 10, 20, 30, and 40 discharging the liquid or the gas or the liquid and the gas in the tank TK from a position facing a position where the liquid or the gas or the liquid and the gas are sent out to the processing substrate 1 in the tank TK. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
