Heat-expandable microspheres and a method of making heat-expandable microspheres and application thereof

摘要

A heat-expandable microspheres having high heat resistance and high solvent resistance and application thereof are provided.

The heat-expandable microspheres comprise a shell of a thermoplastic resin and a thermally vaporizable blowing agent being encapsulated therein. The thermoplastic resin comprises a copolymer produced by polymerizing a polymerizable component comprising a carboxyl-group-containing monomer. The maximum expansion ratio of the heat-expandable microspheres is at least 30 times. The ranges of the variation in the expansion-initiating temperature and maximum expansion temperature of the heat-expandable microspheres after dispersing 5 parts by weight of the microspheres in 100 parts by weight of deionized water are each not greater than 10 percent of the temperatures before the dispersion.