| 摘要 |
A light emitting assembly including a substrate having electrically conductive pathways that electrically connect a plurality of electrical component dies. The said electrical components include at least one light emitting diode engaged along the substrate to form an interface surface between the light emitting diode and the substrate. Therefore the combined and unified vector of thermal conduction from the light emitting diode dies are perpendicular to the interface surface when the combined and unified vector of thermal conduction crosses the interface surface from the light emitting diode die to the substrate. |
