发明名称 |
Silver bond wire for semiconductor devices |
摘要 |
A bonding wire for semiconductor devices and a method of manufacturing the same are disclosed. The bonding wire for semiconductor devices according to the present invention includes at least one selected from the group consisting of zinc (Zn), tin (Sn), and nickel (Ni) at 5 ppm to 10 wt%, and the remainder including silver (Ag) and other inevitable impurities. |
申请公布号 |
EP2757585(A3) |
申请公布日期 |
2014.10.29 |
申请号 |
EP20140001027 |
申请日期 |
2012.11.02 |
申请人 |
HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG |
发明人 |
CHUNG, EUN-KYUN;RYU, JAE-SUNG;TARK, YONG-DEOK |
分类号 |
H01L23/49;C22C5/06;H01L33/62 |
主分类号 |
H01L23/49 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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