Negative-type photosensitive resin composition, pattern forming method and electronic parts

摘要

A negative-type photosensitive resin composition which is good in sensitivity and resolution, a pattern forming method by the use thereof wherein a pattern which can be developed in an alkali aqueous solution, is excellent in sensitivity, resolution and heat resistance and has a good shape is obtained, and highly reliable electronic parts are provided. The negative-type photosensitive rein composition includes (a) a polymer that has a phenolic hydroxyl group at a terminal and is soluble in the alkali aqueous solution, (b) a compound that generates an acid by irradiating active light, and (c) a compound that can be crosslinked or polymerized by an action of the acid.

主权项

1. A photosensitive resin composition comprising:
(a) a polymer that has a phenolic hydroxyl group at a terminal thereof and is soluble in an alkali aqueous solution, wherein the phenolic hydroxyl group is at a meta-position with respect to a binding site of the phenolic group, and wherein the polymer comprises at least one heat-resistant polymer compound selected from the group consisting of polyimide, polyoxazole, polyamideimide, polyamide, polyamic acid, polyamic acid ester and polyhydroxyamide; (b) a second compound that generates an acid by irradiating active light, wherein the second compound is selected from the group consisting of compounds represented by one of the following formulas B1 and B2, (c) a third compound that can be crosslinked or polymerized by an action of the acid, wherein the third compound represented by the general formula (II), wherein two Y each independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, an oxygen atom or a fluorine atom; R3 and R4 each independently represent a hydrogen atom; R5 and R6 each independently represent a hydrogen atom or a monovalent organic group; m and g each independently represent integers of 1 to 3; and e and f each independently represent integers of 0 to 4; or the third compound is a compound represented by the general formula (III), wherein multiple R7 and R8 each independently represent a hydrogen atom or a monovalent organic group, and wherein the photosensitive resin composition is a negative-type photosensitive resin composition.