Routing method for flip chip package and apparatus using the same

摘要

Disclosed herein are rouging methods and devices for a flip-chip package. The flip chip includes several outer pads and several inner pads. The routing method includes: setting an outer sequence based on the arrangement order of the outer pads; setting several inner sequences based on the connection relationships between inner pads and the outer pads; calculating the longest common subsequence of each inner sequence and the outer sequence, defining the connection relationships between the inner pads and the outer pads corresponding to the longest common subsequence as direct connections, and defining the connection relationships between the inner pads and the outer pads that do not correspond to the longest common subsequence as detour connections; establishing the routing scheme of the flip chip based on the connection relationships between the inner pads and the outer pads.

主权项

1. A routing method for a flip-chip package including a flip chip having outer pads and inner pads, the routing method comprising:
setting several pad arrays based on an arrangement order of the outer pads and the inner pads of the flip chip; establishing, with a computer, a routing path sequentially from an innermost pad array toward outer pad arrays, wherein establishing the routing path comprises:
establishing a virtual ring including virtual pads based on a current pad array of the several pad arrays and a pad array directly above; andestablishing chords on the virtual ring based on a maximum planar subset of chords and connection relationships between the virtual pads on the virtual ring; and selecting the routing path configured to provide a most direct connection between each pad array and the pad array directly above.