发明名称 |
Scaling of bipolar transistors |
摘要 |
Bipolar transistor structures, methods of designing and fabricating bipolar transistors, methods of designing circuits having bipolar transistors. The method of designing the bipolar transistor includes: selecting an initial design of a bipolar transistor; scaling the initial design of the bipolar transistor to generate a scaled design of the bipolar transistor; determining if stress compensation of the scaled design of the bipolar transistor is required based on dimensions of an emitter of the bipolar transistor after the scaling; and if stress compensation of the scaled design of the bipolar transistor is required then adjusting a layout of a trench isolation layout level of the scaled design relative to a layout of an emitter layout level of the scaled design to generate a stress compensated scaled design of the bipolar transistor. |
申请公布号 |
US8872236(B2) |
申请公布日期 |
2014.10.28 |
申请号 |
US201113195155 |
申请日期 |
2011.08.01 |
申请人 |
International Business Machines Corporation |
发明人 |
Joseph Alvin Jose;Malladi Ramana Murty;Slinkman James Albert |
分类号 |
H01L29/66;G06F17/50;H01L21/8249;H01L29/732;H01L21/762 |
主分类号 |
H01L29/66 |
代理机构 |
Schmeiser, Olsen & Watts |
代理人 |
Schmeiser, Olsen & Watts ;Canale Anthony |
主权项 |
1. A bipolar transistor, comprising:
a dielectric filled trench in a substrate, said dielectric filled trench surrounding and abutting a perimeter of a collector in said substrate; a base on said collector; an emitter in said base, said base extending over said trench; a dielectric capping layer on exposed regions of said substrate; and wherein said base includes (i) a single crystal extrinsic base region surrounding a single crystal intrinsic base region and (ii) an extrinsic polysilicon base region surrounding said single crystal extrinsic base region. |
地址 |
Armonk NY US |