发明名称 Semiconductor structure
摘要 A semiconductor structure includes a barrier layer, a spacer structure, and a channel layer. The barrier layer includes a group III nitride. The spacer structure includes first and second aluminum nitride layers and an intermediate layer. The intermediate layer includes a group III nitride and is between the first and second aluminum nitride layers. The intermediate layer has a first free charge carrier density at an interface with the second aluminum nitride layer. The spacer structure is between the barrier layer and the channel layer. The channel layer includes a group III nitride and has a second free charge carrier density at an interface with the first aluminum nitride layer of the spacer structure. The first aluminum nitride layer, the intermediate layer, and the second aluminum nitride layer have layer thicknesses so the first free charge carrier density is less than 10% of the second free charge carrier density.
申请公布号 US8872233(B2) 申请公布日期 2014.10.28
申请号 US201213419583 申请日期 2012.03.14
申请人 Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V. 发明人 Lim Taek;Aidam Rolf;Kirste Lutz;Quay Ruediger
分类号 H01L29/66;H01L21/338;H01L29/778;H01L27/06 主分类号 H01L29/66
代理机构 Keating & Bennett, LLP 代理人 Keating & Bennett, LLP
主权项 1. A semiconductor structure comprising: a barrier layer comprising AIGaInN, AIInN or AIGaN; a spacer structure comprising a first aluminum nitride layer, an intermediate layer and a second aluminum nitride layer, wherein the intermediate layer comprises a group III nitride and is arranged between the first aluminum nitride layer and the second aluminum nitride layer and wherein the intermediate layer comprises a first free charge carrier density at an interface with the second aluminum nitride layer; and a channel layer comprising a group III nitride, wherein the spacer structure is arranged between the barrier layer and the channel layer, wherein the spacer structure is grown on the channel layer and the AIGaInN barrier layer, the AIInN barrier layer or the AIGaN barrier layer is grown on the spacer structure, and wherein the channel layer comprises a second free charge carrier density at an interface with the first aluminum nitride layer of the spacer structure, wherein the first aluminum nitride layer, the intermediate layer and the second aluminum nitride layer comprise layer thicknesses such that the first free charge carrier density is less than 10% of the second free charge carrier density.
地址 Munich DE