| 发明名称 | Lead frame having a perimeter recess within periphery of component terminal | ||
| 摘要 | Embodiments described herein relate to manufacturing a device. The method includes etching at least one recess pattern in an internal surface of a lead frame, the at least one recess pattern including a perimeter recess that defines a perimeter of a mounting area. The method also includes attaching a component to the internal surface of the lead frame such that a single terminal of the component is attached in the mounting area and the single terminal covers the perimeter recess, wherein the perimeter recess has a size and shape such that the recess is proximate a perimeter of the single terminal. | ||
| 申请公布号 | US8871572(B2) | 申请公布日期 | 2014.10.28 |
| 申请号 | US201213722063 | 申请日期 | 2012.12.20 |
| 申请人 | Intersil Americas LLC | 发明人 | Cruz Randolph;Carpenter, Jr. Loyde M. |
| 分类号 | H01L21/00;H01L23/495;H01L23/00 | 主分类号 | H01L21/00 |
| 代理机构 | Fogg & Powers LLC | 代理人 | Fogg & Powers LLC |
| 主权项 | 1. A method of manufacturing a device, the method comprising: etching at least one recess pattern in an internal surface of a lead frame, the at least one recess pattern including a perimeter recess that defines a perimeter of a mounting area; placing component attach adhesive on one or more raised surfaces in the mounting area; and attaching a component to the internal surface of the lead frame such that a single terminal of the component is attached in the mounting area and the single terminal covers the perimeter recess, wherein the perimeter recess has a size and shape such that the recess is proximate a perimeter of the single terminal, wherein the perimeter recess defines a continuous outer wall to impede flow of the component attach adhesive. | ||
| 地址 | Milpitas CA US | ||