Wafer encapsulated microelectromechanical structure and method of manufacturing same

摘要

There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ wafer bonding encapsulation techniques.

主权项

1. A method comprising:
forming a cavity in a first substrate; depositing an intermediate layer on the first substrate after forming the cavity; securing a second substrate to the intermediate layer; forming a microelectromechanical structure in a portion of the second substrate; encapsulating the microelectromechanical structure; and wherein forming the microelectromechanical structure in the portion of the second substrate comprises forming the microelectromechanical structure in the portion of the second substrate before securing the second substrate to the intermediate layer.