| 发明名称 | Heat-insulating packaging film, packaging bag, and packaging bag having opening member | ||
| 摘要 | A thermal insulating packaging film which includes: a base material; and an open-cell layer disposed on one face of the base material and made of polyolefin. The open-cell layer in the thermal insulating packaging film preferably has an average bore diameter of 150 μm to 500 μm. | ||
| 申请公布号 | US8870016(B2) | 申请公布日期 | 2014.10.28 |
| 申请号 | US201113806095 | 申请日期 | 2011.06.24 |
| 申请人 | Hosokawa Yoko Co., Ltd. | 发明人 | Ishikawa Daisaku;Shinohara Tomonari;Kobayashi Yukio;Tanaka Hidekazu;Maru Takashi;Kohno Hiroshi;Akamatsu Masayuki |
| 分类号 | B65D81/38;B32B7/12;B32B27/32;B32B5/20;B32B27/06;B32B27/36 | 主分类号 | B65D81/38 |
| 代理机构 | Nixon Peabody LLP | 代理人 | Nixon Peabody LLP |
| 主权项 | 1. A thermal insulating packaging film comprising a base material and an open-cell layer which is made of polyolefin disposed on one face of the base material, wherein the open cell layer is formed of a base resin and a forming promotion resin with a relatively low melt tension compared to the base resin and an average bore diameter of an opening of the open-cell layer is larger than a thickness of the open-cell layer. | ||
| 地址 | Tokyo JP | ||