CMP SLURRY COMPOSITION FOR ORGANIC FILM AND POLISHING METHOD USING THE SAME

摘要

The present invention relates to a CMP slurry composition for an organic film, which includes a polar solvent and/or a non-polar solvent; and a metal oxide abrasive, is acidic, and is for polishing the organic film having carbon content of 50 to 95 atom%, and to a polishing method using the same. According to the present invention, provided is a CMP slurry composition for an organic film having excellent polishing effect to the organic film having high carbon content, and density and hardness of a film.