| 发明名称 | Light emitting device package | ||
| 摘要 | A light emitting device package including a package body including a plurality of first ceramic layers, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, and a heat dissipation member disposed in the package body to thermally come into contact with the light emitting device, wherein the heat dissipation member is provided with an expanded portion at a region corresponding to a boundary of different first ceramic layers. | ||
| 申请公布号 | US8872195(B2) | 申请公布日期 | 2014.10.28 |
| 申请号 | US201414275725 | 申请日期 | 2014.05.12 |
| 申请人 | LG Innotek Co., Ltd. | 发明人 | Kim Byung Mok;Kang Bo Hee;Kim Ha Na;Kodaira Hiroshi;Tanda Yuichiro;Ozeki Satoshi |
| 分类号 | F21V29/00;F21V31/00;H01L33/64;A61L2/08 | 主分类号 | F21V29/00 |
| 代理机构 | Birch, Stewart, Kolasch & Birch, LLP | 代理人 | Birch, Stewart, Kolasch & Birch, LLP |
| 主权项 | 1. A light emitting device package comprising: a package body including a plurality of first ceramic layers; at least one electrode pattern placed on the package body; at least one light emitting device electrically connected to the electrode pattern; and a heat dissipation member disposed in the package body to thermally come into contact with the light emitting device, wherein the heat dissipation member is provided with an expanded portion at a region corresponding to a boundary of different first ceramic layers. | ||
| 地址 | Seoul KR | ||