Manufacturing electronic device having contact elements with a specified cross section

摘要

An electronic device and manufacturing thereof. One embodiment provides a carrier and multiple contact elements. The carrier defines a first plane. A power semiconductor chip is attached to the carrier. A body is formed of an electrically insulating material covering the power semiconductor chip. The body defines a second plane parallel to the first plane and side faces extends from the first plane to the second plane. At least one of the multiple contact elements has a cross section in a direction orthogonal to the first plane that is longer than 60% of the distance between the first plane and the second plane.

主权项

1. A method, comprising:
providing a device, comprising:
a carrier and multiple contact elements, the carrier defining a portion of a bottom surface of the device at a first plane;a power semiconductor chip attached to the carrier; and
a body formed of an electrically insulating material covering the power semiconductor chip, the body defining a second plane parallel to the first plane and side faces extending from the first plane to the second plane; wherein each of the multiple contact elements has a first surface which forms a portion of the bottom surface of the device at the first plane and a second surface which is coplanar with the electrically insulating material and together with the electrically insulating materials forms one of the side faces of the device, wherein at least one of the multiple contact elements has a cross section in a direction orthogonal to the first plane that is longer than 30% of the distance between the first plane and the second plane; and wave soldering the device to a circuit board via second surfaces of the multiple contact elements forming a portion of the side faces of the device.