Packages and method of forming the same

摘要

A method includes forming a dielectric layer over a substrate, forming an interconnect structure over the dielectric layer, and bonding a die to the interconnect structure. The substrate is then removed, and the dielectric layer is patterned. Connectors are formed at a surface of the dielectric layer, wherein the connectors are electrically coupled to the die.

主权项

1. A method comprising:
forming a first dielectric layer over a substrate; forming an interconnect structure over the first dielectric layer, wherein the interconnect structure comprises redistribution lines in at least one second dielectric layer; bonding a die to the interconnect structure; performing a pre-cut on the interconnect structure to form a trench, wherein the trench extends into the interconnect structure; after the performing the pre-cut, molding a polymer on the die, wherein the polymer is in contact with edges of the die; removing the substrate to reveal the first dielectric layer; after the removing the substrate, patterning the first dielectric layer; and forming connectors at a surface of the first dielectric layer, wherein the connectors are electrically coupled to the die.