| 摘要 |
<p>PURPOSE: A metal lamination for circuit board and a manufacturing method thereof are provided to enhance mechanical physical property and low dielectric constant and coefficient of thermal expansion. CONSTITUTION: A metal lamination for circuit board comprises a polyimide resin layer which includes polyamide including 50-100 mol% of recurring unit of chemical formula 1 and one or more of metal layer. The polyamide has average molecular weight of 5000-500000. In the chemical formula 1, R1 is tetravalent organic functional group. R1 is tetra organic radical which is selected from a group consisting of chemical formula 10-23.</p> |
