发明名称 |
Method for manufacturing molecular memory device |
摘要 |
According to one embodiment, a method for manufacturing a molecular memory device includes: forming a first wiring layer including a plurality of first wirings extending in a first direction; forming a sacrificial film on the first wiring layer; forming a plurality of core members on the first wiring layer, the core member extending in a second direction crossing the first direction and being formed from an insulating material different from the sacrificial film; forming a second wiring on a side surface of the core member; removing a portion of the sacrificial film located immediately below the second wiring; embedding a polymer; and embedding an insulating. The embedding a polymer includes embedding a polymer serving as a memory material between the first wiring and the second wiring. The embedding an insulating member includes embedding an insulating member in a space between the second wirings between the core members. |
申请公布号 |
US8871602(B2) |
申请公布日期 |
2014.10.28 |
申请号 |
US201213422488 |
申请日期 |
2012.03.16 |
申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
Yamashita Hiroki |
分类号 |
H01L21/02;H01L27/28;G11C13/00;H01L51/05 |
主分类号 |
H01L21/02 |
代理机构 |
Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P. |
代理人 |
Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P. |
主权项 |
1. A method for manufacturing a molecular memory device, comprising:
forming a first wiring layer including a plurality of first wirings extending in a first direction; forming a sacrificial film on the first wiring layer; forming a plurality of core members on the first wiring layer, the core members extending in a second direction crossing the first direction and being formed from an insulating material different from the sacrificial film; forming second wirings on side surfaces of the core members; removing portions of the sacrificial film located immediately below the second wirings to form first spaces between the first in and the second wirings; embedding, after forming the second wirings and removing the portions of the sacrificial film, a polymer serving as a memory material into the first spaces; and embedding an insulating member in a second space between the second wirings between the core members. |
地址 |
Tokyo JP |