Distributed semiconductor device methods, apparatus, and systems

摘要

Some embodiments include a device having a number of memory cells and associated circuitry for accessing the memory cells. The memory cells of the device may be formed in one or more memory cell dice. The associated circuitry of the device may also be formed in one or more dice, optionally separated from the memory cell dice.

主权项

1. An apparatus comprising:
a plurality of dice including a first die, a second die and a third die, at least one of the first die and the second die including a memory array, wherein among the first die, the second die, and the third die, only the third die includes a sense amplifier to determine values of data transferred to and from the memory array; and a connection coupled to the dice to provide communication among the dice, wherein the connection includes at least one conductive path passing through one of the dice.