Stacked chip module with integrated circuit chips having integratable built-in self-maintenance blocks

摘要

Disclosed is a stacked chip module and associated method with integrated circuit (IC) chips having integratable built-in self-maintenance blocks. The module comprises a stack of chips and each chip comprises a self-maintenance block with first and second controllers. The first controller controls wafer-level and module-level servicing (e.g., self-testing or self-repairing) of an on-chip functional block. The second controller provides an interface between an off-chip tester and the first controller during wafer-level servicing. Each chip further comprises a plurality of interconnect structures (e.g., multiplexers and through-substrate-vias) that integrate the self-maintenance blocks of adjacent chips in the stack so that, during module-level servicing, a single second controller on a single one of the chips in the stack (e.g., the bottom chip) provides the only interface between the off-chip tester and all of the first controllers.

主权项

1. A stacked chip module comprising a stack of integrated circuit chips, each of said integrated circuit chips in said stack comprising:
a functional block on a substrate; a self-maintenance block on said substrate, said self-maintenance block comprising:
a first controller controlling servicing of said functional block during wafer-level servicing and during module-level servicing; anda second controller providing an interface between an off-chip tester and said first controller during said wafer-level servicing; and a plurality of interconnect structures on said substrate and integrating said self-maintenance block with an adjacent self-maintenance block of at least one adjacent integrated circuit chip in said stack such that, during said module-level servicing, a single second controller on a single integrated circuit chip in said stack provides an interface between said off-chip tester and each first controller on each of said integrated circuit chips in said stack.