发明名称 Chip module structure for particles protection
摘要 The present invention provides a chip module structure for particles protection. The structure includes a substrate. A chip is configured on the substrate, with a sensing area. A holder is disposed on the substrate, wherein the holder has a first rib. A transparent material is disposed on the holder, substantially aligning to the sensing area. A lens holder is disposed on the holder, and a lens is configured on the lens holder, substantially aligning to the transparent material and the sensing area. The lens has a second rib, wherein the second rib is disposed corresponding to the first rib for blocking particles entering into the chip module structure.
申请公布号 US8872296(B2) 申请公布日期 2014.10.28
申请号 US201213666093 申请日期 2012.11.01
申请人 Lite-On Technology Corporation 发明人 Jan Shin-Dar
分类号 H01L31/0232;H01L33/00;H01L31/0203;H01L27/146 主分类号 H01L31/0232
代理机构 Li & Cai Intellectual Property (USA) Office 代理人 Li & Cai Intellectual Property (USA) Office
主权项 1. A chip module structure for particles protection, comprising: a substrate; a chip configured on said substrate, with a sensing area; a supporting holder disposed on said substrate, wherein said supporting holder has a first protrusion structure; and a lens holder disposed on said supporting holder, and a lens configured on said lens holder, substantially aligning to said sensing area; wherein said lens has a second protrusion structure, wherein said second protrusion structure of said lens is disposed opposite to said first protrusion structure of said supporting holder, and wherein said first protrusion structure and said second protrusion structure extend in opposite direction, wherein said second protrusion structure of said lens does not contact with said supporting holder for blocking particles by a first side of said first protrusion structure of said lens, and wherein said first protrusion structure of said supporting holder does not contact with said lens and said second protrusion structure is separated by a spacing from said first protrusion structure in the horizontal direction for blocking particles by a second side of said first protrusion structure of said supporting holder entering into said chip module structure.
地址 Taipei TW