发明名称 Thin film transistor and manufacturing method thereof
摘要 A thin film transistor is provided. A thin film transistor according to an exemplary embodiment of the present invention includes: a substrate; a gate line disposed on the substrate and including a gate electrode; a semiconductor layer disposed on the substrate and including at least a portion overlapping the gate electrode; a gate insulating layer disposed between the gate line and the semiconductor layer; and a source electrode and a drain electrode disposed on the substrate and facing each other over a channel region of the semiconductor layer. The gate insulating layer includes a first region and a second region, the first region corresponds to the channel region of the semiconductor layer, the first region is made of a first material, the second region is made of a second material, and the first material and the second material have different atomic number ratios of carbon and silicon.
申请公布号 US8871577(B2) 申请公布日期 2014.10.28
申请号 US201213436689 申请日期 2012.03.30
申请人 Samsung Display Co., Ltd. 发明人 Jeong Yeon Taek;Kim Bo Sung;Lee Doo-Hyoung;Choi June Whan;Choi Tae-Young;Masataka Kano
分类号 H01L21/00;H01L29/423;H01L29/49 主分类号 H01L21/00
代理机构 Innovation Counsel LLP 代理人 Innovation Counsel LLP
主权项 1. A method of manufacturing a thin film transistor, comprising: forming a gate line on a substrate; forming a gate insulating layer on the gate line; irradiating ultraviolet rays upon the gate insulating layer through a mask; heat treating the gate insulating layer; forming a semiconductor layer on the gate insulating layer; and forming a source electrode and a drain electrode on the semiconductor layer, wherein, in the irradiating, the ultraviolet rays are selectively irradiated upon a portion of the gate insulating layer corresponding to a channel region of the semiconductor layer.
地址 KR