发明名称 Coating treatment apparatus, coating treatment method, and non-transitory computer storage medium
摘要 A coating treatment apparatus includes: a rotating and holding part; a nozzle supplying a coating solution; a moving mechanism moving the nozzle; and a control unit that controls the rotating and holding part, the nozzle, and the moving mechanism to supply the coating solution onto a central portion of the substrate and rotate the substrate at a first rotation speed, then move a supply position of the coating solution from a central position toward an eccentric position of the substrate with the substrate being rotated at a second rotation speed lower than the first rotation speed while continuing supply of the coating solution, then stop the supply of the coating solution with the rotation speed of the substrate decreased to a third rotation speed lower than the second rotation speed, and then increase the rotation speed of the substrate to be higher than the third rotation speed.
申请公布号 US8871301(B2) 申请公布日期 2014.10.28
申请号 US201213344811 申请日期 2012.01.06
申请人 Tokyo Electron Limited 发明人 Tachibana Kouzou;Otsuka Takahisa;Nishiya Akira
分类号 B05D3/12;G03F7/16;H01L21/67;B05D1/00 主分类号 B05D3/12
代理机构 Posz Law Group, PLC 代理人 Posz Law Group, PLC
主权项 1. A coating treatment method, comprising the steps of: horizontally holding a substrate by a rotating and holding part; supplying a coating solution for forming a coating film on a front surface of the substrate from a nozzle to a central portion of the substrate, and rotating the substrate at a first rotation speed to spread the coating solution to a peripheral portion of the substrate by a centrifugal force; then decreasing a rotation speed of the substrate to a second rotation speed lower than the first rotation speed and keeping the rotation speed of the substrate at the second rotation speed for a first predetermined time while continuing supply of the coating solution, and moving the nozzle from a central position toward an eccentric position of the substrate with the substrate being rotated, then decreasing the rotation speed of the substrate to a third rotation speed lower than the second rotation speed and keeping the rotation speed of the substrate constant at the third rotation speed for a second predetermined time while continuing supply of the coating solution, and then stopping the supply of the coating solution from the nozzle to the eccentric position after a lapse of a third predetermined time from a time when the rotation speed of the substrate reaches the third rotation speed, and then increasing the rotation speed of the substrate to be higher than the third rotation speed so as to spread a solution puddle to the peripheral portion of the substrate to form a coating film.
地址 Tokyo JP