发明名称 |
Semiconductor package and display apparatus using the same |
摘要 |
A semiconductor package includes a flexible base film having a first surface opposing a second surface, a semiconductor chip mounted on the first surface of the base film, and a touch sensing structure including at least one conductive pattern adjacent to the semiconductor chip. The at least one conductive pattern is disposed through the base film and has a surface exposed at the second surface of the base film. A contact condition of the semiconductor package is determined based on detection of a conductive path between the at least one conductive pattern and a conductive frame or support surface of the semiconductor package. The contact condition provides an indication of heat dissipation that may be expected to occur for the chip during operation. |
申请公布号 |
US8872337(B2) |
申请公布日期 |
2014.10.28 |
申请号 |
US201314106912 |
申请日期 |
2013.12.16 |
申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
Kim Young-Deuk;Kim Ji-Chul |
分类号 |
H01L27/00;H01L23/36 |
主分类号 |
H01L27/00 |
代理机构 |
Lee & Morse, P.C. |
代理人 |
Lee & Morse, P.C. |
主权项 |
1. A semiconductor package, comprising:
a flexible base film having a first surface opposing a second surface; a semiconductor chip mounted on the first surface of the base film; and a touch sensing structure including at least one conductive pattern adjacent to the semiconductor chip, the at least one conductive pattern being disposed through the base film and having a surface exposed at the second surface of the base film. |
地址 |
Suwon-si, Gyeonggi-do KR |