| 发明名称 | Semiconductor light emitting device | ||
| 摘要 | A semiconductor light emitting device includes: a package which is made of a resin and includes a recess; a lead frame exposed to a bottom of the recess; a semiconductor light emitting element connected to the lead frame in the recess; a phosphor layer over the bottom of the recess; and a second resin layer above the phosphor layer and the semiconductor light emitting element, in which the phosphor layer contains a semiconductor fine particle having an excitation fluorescence spectrum which changes according to a particle size, and the phosphor layer includes a water-soluble or water-dispersible material. | ||
| 申请公布号 | US8872213(B2) | 申请公布日期 | 2014.10.28 |
| 申请号 | US201314011445 | 申请日期 | 2013.08.27 |
| 申请人 | Panasonic Corporation | 发明人 | Yoshida Shinji;Yamanaka Kazuhiko |
| 分类号 | H01L33/00;H01L23/00;H01L33/62;B82Y20/00;H01L33/50;H01L33/60 | 主分类号 | H01L33/00 |
| 代理机构 | McDermott Will & Emery LLP | 代理人 | McDermott Will & Emery LLP |
| 主权项 | 1. A semiconductor light emitting device comprising: a package which is made of a resin and includes a recess; a lead frame exposed to a bottom of the recess; a semiconductor light emitting element connected to the lead frame in the recess; a first resin layer over the bottom of the recess; and a second resin layer above the first resin layer and the semiconductor light emitting element, wherein the first resin layer contains a semiconductor fine particle having an excitation fluorescence spectrum which changes according to a particle size, and the first resin layer comprises a water-soluble or water-dispersible material. | ||
| 地址 | Osaka JP | ||