| 摘要 |
The present invention relates to a carrier head in a chemical mechanical polishing apparatus and a membrane used therein. The carrier head comprises: a main body; a base which rotates with the main body; a retainer ring which has a ring shape covering around the base, and rotates with the main body by being installed to be supported by one among the main body or the base; and a membrane. The membrane has: a bottom plate whose bottom comes into contact with a surface of a wafer during a chemical mechanical polishing process; and a side formed by bending at the radial end of the base plate. A pressurizing chamber is formed at the upper part of the side by forming a first fixing flip fixed to the retainer ring and a second fixing flip fixed to the base on the side by extending. Also, the membrane forms pressure chambers in a space made between the base and the membrane. As a result of placing the pressurizing chamber at the upper part of the side of the membrane, the entire force introduced by adjusting the pressure of the pressurizing chamber can be used as a vertical pressing force pressurizing an edge of a wafer, thereby applying the accurate vertical pressing force to an edge of a wafer. |
