发明名称 Circuit module including a duplexer mounted on a circuit substrate having a specified second ground path
摘要 A circuit module includes a duplexer and a circuit substrate. A first signal path connects a first external electrode to a second external electrode. A second signal path connects a third external electrode to a fourth external electrode. A third signal path connects a fifth external electrode to a sixth external electrode. A first ground path connects a seventh external electrode to an eighth external electrode. A second ground path is connected to a ninth external electrode and is capacitively coupled to the second signal path.
申请公布号 US8872601(B2) 申请公布日期 2014.10.28
申请号 US201213654521 申请日期 2012.10.18
申请人 Murata Manufacturing Co., Ltd. 发明人 Yamane Takashi;Ikada Katsuhiro;Hirano Yasuhiko
分类号 H03H7/46;H03H9/72;H04B1/48;H04B1/50;H03H9/05 主分类号 H03H7/46
代理机构 Keating & Bennett, LLP 代理人 Keating & Bennett, LLP
主权项 1. A circuit module comprising: a duplexer; and a circuit substrate on which the duplexer is mounted;wherein the duplexer includes: a duplexer main body;first, second and third external electrodes and a plurality of duplexer ground external electrodes provided on the duplexer main body;a first filter that outputs a signal input at the first external electrode to the second external electrode;a second filter that outputs a signal input at the third external electrode to the first external electrode;a ground conductor that is connected to the duplexer ground external electrodes and that is maintained at a ground potential; and the circuit substrate includes: a substrate main body;fourth, fifth and sixth external electrodes and a plurality of substrate top surface ground external electrodes that are provided on the substrate main body and that are respectively connected to the first, second and third external electrodes and the plurality of the duplexer ground external electrodes;seventh, eighth and ninth external electrodes and a substrate bottom surface ground external electrode provided on the substrate main body;a first signal path that connects the fourth external electrode to the seventh external electrode, a second signal path that connects the fifth external electrode to the eighth external electrode, and a third signal path that connects the sixth external electrode to the ninth external electrode;a first ground path that connects a portion of the plurality of the substrate top surface ground external electrodes to the substrate bottom surface ground external electrode; anda second ground path that is connected to the substrate top surface ground external electrode which is not connected to the substrate bottom surface ground external electrode and that is electromagnetically coupled to the second signal path or the third signal path.
地址 Kyoto JP