发明名称 |
Bonding material |
摘要 |
Provided is a bonding material which can bond base materials or substrates having different linear thermal expansion coefficients, and can have heat resistance against temperatures of 300° C. or higher, vacuum airtightness and bonding strength, further which has excellent handleability and workability. The bonding material is produced by mixing, in a content ratio of 0.01 to 60 mass % (to the whole), a metal Ga, and/or at least one metal or alloy powder selected from the group consisting of a metal powder mixture of a combination of Bi and Sn or an alloy powder thereof, and a metal powder mixture of a combination of Bi, Sn and Mg or an alloy powder thereof with a Bi2O3-based glass frit powder having an average particle diameter of 200 μm or less. The bonding material may be formed in a paste form by adding a solvent thereto. This feature makes it possible to bond together substrates having different thermal expansion coefficients without causing a crack or unsticking. |
申请公布号 |
US8871661(B2) |
申请公布日期 |
2014.10.28 |
申请号 |
US201013806868 |
申请日期 |
2010.09.07 |
申请人 |
Sophia Product Co. |
发明人 |
Yamada Minoru |
分类号 |
C03C8/24;C03C8/14;C03C8/18;C03C8/02;C09J1/00;C03C8/04;C03C27/10 |
主分类号 |
C03C8/24 |
代理机构 |
Steptoe & Johnson LLP |
代理人 |
Steptoe & Johnson LLP |
主权项 |
1. A bonding material for bonding between members comprising:
Bi2O3-based glass frit containing at least Bi2O3; and at least one powder selected from the group consisting of BiSn alloy powder and a metal powder mixture of Bi powder and Sn powder, wherein the BiSn alloy powder, and/or the metal powder mixture of Bi powder and Sn powder are/is mixed with the Bi2O3-based glass frit containing at least Bi2O3 in a content ratio of 3 to 60 mass % (to the whole). |
地址 |
Toyko JP |