Methods for fabricating and orienting semiconductor wafers

摘要

A method of orienting a semiconductor wafer. The method includes rotating a wafer about a central axis; exposing a plurality of edge portions of the rotating wafer to light having a predetermined wavelength from one or more light sources; detecting a subsurface mark in one of the plurality of edge portions of the rotating wafer; and orienting the wafer using the detected subsurface mark as a reference.

主权项

1. A method, comprising:
positioning a semiconductor wafer in or on a wafer retaining device; irradiating a predetermined first portion of the wafer in an edge exclusion area of the wafer, so as to alter a crystalline structure of a subsurface first part of the first portion of the wafer to form a subsurface mark, wherein the subsurface mark is detectable using light of a predetermined wavelength having a predetermined transmittance through the wafer and at a predetermined reflectance angle relative to an axis of rotation of the wafer and based on the predetermined wavelength.