发明名称 |
Method of manufacturing IC comprising a bipolar transistor and IC |
摘要 |
Disclosed is an integrated circuit and a method of manufacturing an integrated circuit comprising a bipolar transistor, the method comprising providing a substrate comprising a pair of isolation regions separated by an active region comprising a collector; forming a base layer stack over said substrate; forming a migration layer having a first migration temperature and an etch stop layer; forming a base contact layer having a second migration temperature; etching an emitter window in the base contact layer, thereby forming cavities extending from the emitter window; and exposing the resultant structure to the first migration temperature in a hydrogen atmosphere, thereby filling the cavities with the migration layer material. |
申请公布号 |
US8871599(B2) |
申请公布日期 |
2014.10.28 |
申请号 |
US201213599389 |
申请日期 |
2012.08.30 |
申请人 |
NXP, B.V. |
发明人 |
Donkers Johannes Josephus Theodorus Marinus;Magnee Petrus Hubertus Cornelis;Duriez Blandine;Gridelet Evelyne;Mertens Hans;Vanhoucke Tony |
分类号 |
H01L21/331;H01L21/8249;H01L29/737 |
主分类号 |
H01L21/331 |
代理机构 |
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代理人 |
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主权项 |
1. A method of manufacturing an integrated circuit comprising a bipolar transistor, the method comprising:
providing a substrate comprising a pair of first isolation regions separated from each other by an active region comprising a collector impurity of said bipolar transistor; forming a base layer stack over said substrate; forming a further stack of a migration layer having a first migration temperature and an etch stop layer over said base layer stack; forming a base contact layer having a second migration temperature over the further stack, the second migration temperature being higher than the first migration temperature; etching an emitter window in the base contact layer over the active region, said etching step terminating at the etch stop layer; at least partially removing the etch stop layer, thereby forming cavities extending from the emitter window in between the base contact layer and the migration layer; and exposing the resultant structure to the first migration temperature in a hydrogen atmosphere, thereby filling the cavities with the migration layer material; wherein the migration layer is formed on the etch stop layer, and wherein said etching step further comprises removing the migration layer from over the active region. |
地址 |
Eindhoven NL |