发明名称 Method of manufacturing IC comprising a bipolar transistor and IC
摘要 Disclosed is an integrated circuit and a method of manufacturing an integrated circuit comprising a bipolar transistor, the method comprising providing a substrate comprising a pair of isolation regions separated by an active region comprising a collector; forming a base layer stack over said substrate; forming a migration layer having a first migration temperature and an etch stop layer; forming a base contact layer having a second migration temperature; etching an emitter window in the base contact layer, thereby forming cavities extending from the emitter window; and exposing the resultant structure to the first migration temperature in a hydrogen atmosphere, thereby filling the cavities with the migration layer material.
申请公布号 US8871599(B2) 申请公布日期 2014.10.28
申请号 US201213599389 申请日期 2012.08.30
申请人 NXP, B.V. 发明人 Donkers Johannes Josephus Theodorus Marinus;Magnee Petrus Hubertus Cornelis;Duriez Blandine;Gridelet Evelyne;Mertens Hans;Vanhoucke Tony
分类号 H01L21/331;H01L21/8249;H01L29/737 主分类号 H01L21/331
代理机构 代理人
主权项 1. A method of manufacturing an integrated circuit comprising a bipolar transistor, the method comprising: providing a substrate comprising a pair of first isolation regions separated from each other by an active region comprising a collector impurity of said bipolar transistor; forming a base layer stack over said substrate; forming a further stack of a migration layer having a first migration temperature and an etch stop layer over said base layer stack; forming a base contact layer having a second migration temperature over the further stack, the second migration temperature being higher than the first migration temperature; etching an emitter window in the base contact layer over the active region, said etching step terminating at the etch stop layer; at least partially removing the etch stop layer, thereby forming cavities extending from the emitter window in between the base contact layer and the migration layer; and exposing the resultant structure to the first migration temperature in a hydrogen atmosphere, thereby filling the cavities with the migration layer material; wherein the migration layer is formed on the etch stop layer, and wherein said etching step further comprises removing the migration layer from over the active region.
地址 Eindhoven NL