发明名称 Pattern measuring apparatus
摘要 An object of the present invention is to provide a pattern measuring apparatus which performs high-accuracy concavity/convexity determination (e.g., distinguishing between a line segment and space) while simultaneously reducing the dose of a beam falling onto a pattern to be measured. To attain the object, this invention proposes a pattern measuring apparatus which specifies a pattern in a measurement object area by scanning a tilted bean with respect to another area different from the measurement object area and then performs measurement based on the pattern-specifying result. With such arrangement, it becomes possible to perform measurement without the risk of wrong pattern designation while lowering the dose of a beam hitting the measurement object area.
申请公布号 US8872106(B2) 申请公布日期 2014.10.28
申请号 US201313789346 申请日期 2013.03.07
申请人 Hitachi High-Technologies Corporation 发明人 Nishihama Hiroshi;Maeda Tatsuya;Ikeda Mitsuji;Koyama Susumu
分类号 H01J37/00;H01J37/26 主分类号 H01J37/00
代理机构 McDermott Will & Emery LLP 代理人 McDermott Will & Emery LLP
主权项 1. A pattern measuring apparatus, comprising: an arithmetical unit configured to perform, by way of a programmed processor: determining a pattern size by using a signal to be obtained based on scanning of a charged particle beam emitted from a charged particle source; and a beam tilting deflector for irradiating the charged particle beam while tilting this beam with respect to an ideal light axis thereof, wherein the arithmetical unit is configured to perform, by way of the programmed processor: specifying a kind of a pattern formed on a sample based on a signal obtained by obliquely scanning the beam in an area of the sample being different from an area used to obtain the pattern size.
地址 Tokyo JP