| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device that can achieve high cooling performance and dimensional accuracy.SOLUTION: In a semiconductor device 1 according to the invention, a semiconductor module 3 is pressed to a cooling device 4 by a spring member 2. The spring member 2 is compressed by a beam member 6 connected to a support 5 fixed to the cooling device 4. The cooling device 4 has a pressed portion 4A to which the semiconductor module 3 is pressed and a support fixing portion 4B to which the support 5 is fixed. The support fixing portion 4B has a higher rigidity than the pressed portion 4A.</p> |
