发明名称 SEMICONDUCTOR DEVICE
摘要 Disclosed herein is a device that includes a first wiring provided as a first-level wiring layer and elongated in a first direction; and a first wiring pad provided as the first-level wiring layer, the first wiring pad being rectangular and including a first side edge that is elongated in the first direction and a second side edge that is elongated in a second direction crossing to the first direction, the first side edge being greater in length than the second side edge, the first wiring pad being greater in length in the second direction than the first wiring.
申请公布号 KR101453167(B1) 申请公布日期 2014.10.27
申请号 KR20120133780 申请日期 2012.11.23
申请人 发明人
分类号 H01L21/768;H01L21/8242;H01L27/108 主分类号 H01L21/768
代理机构 代理人
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