| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering device for soldering a component to be mounted on a circuit board onto the circuit board by melting a solder while using a current which flows in the case where the component is operated, without using an external heat source.SOLUTION: A soldering device 10 is configured to solder a lead wire 5 of a component 1 which is operated by electrification, to a land part 4 provided on a circuit board 2. The soldering device 10 comprises: a conductive leg part 15 which is electrically connected with the land part 4; a lead wire contact part 16 including an insertion portion of the lead wire while being connected to the lead wire 5; a heating part 12 which is provided between the leg part 15 and the lead wire contact part 16 and generates heat during electrification; and a solder 8 which is provided in the vicinity of the heating part 12 and electrically connected to the lead wire contact part 16 around an outer peripheral surface of the lead wire 5. When a current flows through the land part 4 to the lead wire 5, the lead wire 5 and the land part 4 are soldered by the solder 8 which is melted by heat generated in the heating part 12. |
