| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit module which achieves high design flexibility of a shield shape and secures electric connection between a wiring layer and a shield, and to provide a manufacturing method of the circuit module.SOLUTION: A circuit module 100 according to one embodiment of the invention includes: a wiring board 2; multiple electronic components 3; a sealing layer 4; a conductive shield 5; and a conductive layer 10. The sealing layer 4 coats the multiple electronic components 3, is formed by an insulative material, and has a groove part 41 formed along a border between a first region 2A and a second region 2B. The conductive shield 5 includes: a first shield part 51 which coats an outer surface of the sealing layer 4; and a second shield part 52 provided at the groove part 41. The conductive layer 10 includes: a wiring part 11 which is provided on a mounting surface 2a and electrically connects a terminal surface 2b with the second shield part 52; and a thick part 12 which is provided at the wiring part 11 and partially thickens a connection region of the wiring part 11 connected with the second shield part 52. |
