| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a protective tape, e.g., a dicing tape for use in the dicing step of semiconductor wafer, which allows for detailed observation of the surface of an object to be stuck, in a state stuck thereto, while ensuring sufficient side slip.SOLUTION: A transparent film includes a minute projection layer 3 formed on one side of a substrate 2 by tapering minute protrusions, and an easily peelable adhesive layer 4 on the other side of a substrate 2. The adhesive layer is hardened by irradiation with an active energy beam. The tapered minute projections are formed using a shaping mold having minute projections formed by repeating anodization and etching.</p> |
